Sub-resolutional laser annealing mask
US7804647B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2007 |
| Grant date | Sep 28, 2010 |
| Priority date | — |
| Expiry date | Jul 19, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B13/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for smoothing an annealed surface uses a sub-resolution mask pattern. The method supplies a laser beam having a first wavelength and a mask with a first mask section having apertures with a first dimension and a second mask section with apertures having a second dimension, less than the first dimension. A laser beam having a first energy density is applied to a substrate region, melting a substrate region in response to the first energy density and crystallizing the substrate region. A diffracted laser beam is applied to the substrate region, smoothing the substrate region surface. Applying a diffracted laser beam to the substrate area may include applying a diffracted laser beam having a second energy density, less than the first energy density, to the substrate region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.