Patent · US Active

Method and apparatus for detecting defects in wafers including alignment of the wafer images so as to induce the same smear in all images

US7804993B2 · kind B2 · utility

9Cited by

140References

8Claims

0Family size

Assignee

Applied Materials South East Asia Pte. Ltd. · SG

Inventors

Yuval Dorphan · Zichron Ya'akov, IL
Ran Zaslavsky · Kfar Sava, IL
Mark Wagner · Waynesboro, US
Dov Furman · Rehovot, IL
Shai Silberstein · Nesher, IL

Key dates

Filing date	Feb 28, 2005
Grant date	Sep 28, 2010
Priority date	—
Expiry date	Jun 25, 2027

Classification

Technology area (CPC G)Physics
CPC primaryG01N21/95607
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A method for inspecting a wafer including a multiplicity of dies, the method including dividing an image of at least a portion of the wafer into a plurality of sub-images each representing a sub-portion of the wafer and selecting at least one defect candidate within each sub-image by comparing each sub-image to a corresponding sub-image of a reference including a representation, which is assumed to be faultless, of the portion of the wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.