Substrate heating apparatus and semiconductor fabrication method
US7807553B2 · kind B2 · utility
3Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2007 |
| Grant date | Oct 5, 2010 |
| Priority date | — |
| Expiry date | Jan 21, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/157
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate heating apparatus having a heating unit for heating a substrate placed in a process chamber which can be evacuated includes a suscepter which is installed between the heating unit and a substrate, and on which the substrate is mounted, and a heat receiving member which is installed to oppose the suscepter with the substrate being sandwiched between them, and receives heat from the heating unit via the suscepter. A ventilating portion which allows a space formed between the heat receiving member and substrate to communicate with a space in the process chamber is formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.