Patent · US Active

Electrical component on a substrate and method for production thereof

US7807931B2 · kind B2 · utility

1Cited by

9References

4Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Franz Auerbach · Soest, DE
Bernd Gutsmann · Weyhe, DE
Thomas Licht · Warstein, DE
Norbert Seliger · Munich, DE
Karl Weidner · Birkenfeld, DE
Jörg Zapf · Munich, DE

Key dates

Filing date	Mar 9, 2004
Grant date	Oct 5, 2010
Priority date	—
Expiry date	Dec 10, 2026

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In an arrangement having at least one substrate, at least one electrical component is disposed on a surface section of the substrate and is provided with an electrical contact area, and at least one electrical contact lug has an electrical connecting area electrically contacting the contact area of the component. The connecting area of the contact lug and the contact area of the component are interconnected so that at least one zone of the contact lug protrudes beyond the area of the component. The contact lug is provided with at least one electrically conducting film while the electrically conducting film is provided with the electrical connecting area of the contact lug. The arrangement is particularly useful for large-area, low-inductive contacting of power semiconductor chips, as it allows for high current density.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.