Laser processing apparatus and laser processing method
US7807940B2 · kind B2 · utility
1Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2005 |
| Grant date | Oct 5, 2010 |
| Priority date | — |
| Expiry date | Jan 6, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing apparatus, in accordance with at least one exemplary embodiment, is configured to contemporaneously perform the functions of observing a surface of a substrate and concentrating laser light to a given position inside the substrate. The laser processing apparatus can include an optical system having an afocal optical subsystem configured to concentrate laser light inside the substrate. Adjustment of the position of a laser light concentrating point can be achieved independent of adjustment of a focal point by the automatic focusing mechanism to observe the surface of the substrate irradiated with laser light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.