Integrated heat spreaders for light emitting devices (LEDs) and related assemblies
US7808013B2 · kind B2 · utility
40Cited by
36References
59Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 31, 2006 |
| Grant date | Oct 5, 2010 |
| Priority date | — |
| Expiry date | Jan 5, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8585
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A light emitting device (LED) assembly may include an electrically insulating substrate and a thermally conductive layer on a surface of the insulating substrate. A light emitting device may be on the thermally conductive layer so that the thermally conductive layer is between the light emitting device and the electrically insulating substrate. Moreover, the thermally conductive layer may extend beyond an edge of the light emitting device in at least one direction a distance greater than half of a width of the light emitting device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.