Semiconductor device with a plurality of ground planes
US7808092B2 · kind B2 · utility
10Cited by
8References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 30, 2008 |
| Grant date | Oct 5, 2010 |
| Priority date | — |
| Expiry date | Dec 30, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A multi-chip module (MCM) with a plurality of ground planes/layers is provided. Each integrated circuit (IC) chip of the MCM has its own ground plane on a substrate in the MCM. This MCM structure may facilitate separate testing of each IC chip without affecting other chips and without being affected by other chips. This MCM structure also may facilitate testing of interconnects/connections between two or more chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.