Component assembly and alignment
US7808259B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2007 |
| Grant date | Oct 5, 2010 |
| Priority date | — |
| Expiry date | Mar 7, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method or an apparatus for aligning a plurality of structures can include applying a first force in a first plane to a first structure. The method can also include constraining in the first plane the first structure with respect to a second structure such that the first structure is in a position with respect to the second structure that aligns first features on the first structure with second features on the second structures. The second feature can be in a second plane that is generally parallel to the first plane. The first and second structures can be first and second electronic components, which can be components of a probe card assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.