Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices
US7808434B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2007 |
| Grant date | Oct 5, 2010 |
| Priority date | — |
| Expiry date | Jan 15, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Embodiments of the invention may provide for a variety of antennae structures, including the following: a) antennae structures printed directly on the sides of the radio frequency (RF) module or integrated passive device (IPD), b) printed antennae structures fabricated on preformed dielectric lids or overmolds, c) antennae structures fabricated as part of the dielectric wiring that constitutes the wireless module, d) antennae structures that are printed directly on the top of the finished RF module, and e) antennae structures printed directly on the dielectric layers adjacent to thin film wiring and embedded passive elements such as filters, diplexers and couplers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.