Fluid-ejecting device with simplified connectivity
US7810910B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2006 |
| Grant date | Oct 12, 2010 |
| Priority date | — |
| Expiry date | May 30, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1753
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A fluid-ejecting device with simplified connectivity is disclosed herein. According to an embodiment of the present invention, a common lead is provided such that a plurality of electrical contacts on a fluid-ejecting chip are connected to the common lead, which is located on a single-layer-flex circuit. Because a common lead is provided at an edge of the single-layer-flex circuit adjacent the fluid-ejecting chip, fewer signals need to be routed through the single-layer-flex circuit to such edge, thereby reducing the complexity of such circuit. Further, bond sites at the edge of the single-layer-flex circuit adjacent the fluid-ejecting device are arranged in a manner that minimizes the required length of wire bonds for connecting such contacts to the contacts on the fluid-ejecting chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.