Method and device for bonding wafers
US7811898B2 · kind B2 · utility
2Cited by
6References
13Claims
0Family size
Inventor
Key dates
| Filing date | Oct 10, 2006 |
| Grant date | Oct 12, 2010 |
| Priority date | — |
| Expiry date | Sep 14, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/187
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method and a device (1) for bonding wafers (6, 9). Here at least one wafer surface is first wetted with a molecular dipolar compound, whereupon the wafers are brought into contact with each other. The bonding of the wafers then takes place by means of microwave irradiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.