High density interconnect system for IC packages and interconnect assemblies
US7812626B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2009 |
| Grant date | Oct 12, 2010 |
| Priority date | — |
| Expiry date | Aug 24, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R3/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An improved interconnection system is described, such as for electrical contactors and connectors, electronic device or module package assemblies, socket assemblies, and/or probe card assembly systems. An exemplary connector comprises a first connector structure comprising a contactor substrate having a contact surface and a bonding surface, and one or more electrically conductive micro-fabricated spring contacts extending from the probe surface, a second connector structure comprising at least one substrate and having a set of at least one electrically conductive contact pad located on a connector surface and corresponding to the set of spring contacts, and means for movably positioning and aligning the first connector structure and the second connector structure between at least a first position and a second position, such that in at least one position, at least one electrically conductive micro-fabricated spring contact is electrically connected to at least one electrically conductive contact pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.