Industrial microdeposition system including masking to reduce the impact of droplet alignment and droplet volume tolerances and errors
US7815965B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2009 |
| Grant date | Oct 19, 2010 |
| Priority date | — |
| Expiry date | Sep 18, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/00
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A microdeposition system microdeposits droplets of fluid material to define a feature pattern on a substrate. The feature pattern for the substrate is defined. A mask is created for the feature pattern that reduces a density of defects that occur due to a malfunctioning nozzle of the microdeposition head. The droplets of fluid material are microdeposited onto the substrate based on the mask to define sub-features of the feature pattern. One of the nozzles of the microdeposition head is assigned to each of the sub-features in the feature pattern. The nozzles may be assigned randomly or using other functions. The assigned nozzles in the mask are assigned to one of a plurality of passes of the microdeposition head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.