Process of imaging a photoresist with multiple antireflective coatings
US7816071B2 · kind B2 · utility
7Cited by
4References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2006 |
| Grant date | Oct 19, 2010 |
| Priority date | — |
| Expiry date | Jan 24, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/151
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A process for imaging a photoresist comprising the steps of, a) forming a stack of multiple layers of organic antireflective coatings on a substrate; b) forming a coating of a photoresist over the upper layer of the stack of multiple layers of organic antireflective coatings; c) imagewise exposing the photoresist with an exposure equipment; and, d) developing the coating with a developer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.