Dual-pixel full color CMOS imager with large capacity well
US7816170B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2008 |
| Grant date | Oct 19, 2010 |
| Priority date | — |
| Expiry date | Oct 30, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/802
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A dual-pixel full color CMOS imager comprises a two-photodiode stack including an n doped substrate, a bottom photodiode, and a top photodiode. The bottom photodiode has a bottom p doped layer at a first depth overlying the substrate and a bottom n doped layer cathode overlying the bottom p doped layer. The top photodiode has a top p doped layer overlying the bottom n doped layer and a top n doped layer cathode overlying the top p doped layer. A single photodiode including a bottom p doped layer overlies the substrate at a third depth. The third depth is less than, or equal to the first depth. A bottom n doped layer overlies the bottom p doped layer, a top p doped layer directly overlies the bottom n doped layer without an intervening layer, and a top n doped layer overlies the top p doped layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.