Composition of polycyanate ester and biphenyl epoxy resin
US7816430B2 · kind B2 · utility
2Cited by
5References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2003 |
| Grant date | Oct 19, 2010 |
| Priority date | — |
| Expiry date | Jun 23, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2363/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a resin composition for printed wiring board to be used for electronic devices in which operating frequency exceeds 1 GHz, and a varnish, a prepreg and a metal clad laminated board using the same. One invention of the present invention is a resin composition for printed wiring board containing a cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof, an epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule, and a varnish, a prepreg and a metal clad laminated board using the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.