Adhesive compositions for bonding and filling large assemblies
US7816453B2 · kind B2 · utility
3Cited by
46References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2008 |
| Grant date | Oct 19, 2010 |
| Priority date | — |
| Expiry date | Mar 27, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/24
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Adhesive composition for bonding and filling large assemblies, including a mixture of about 5 percent to about 75 percent by weight of a thermoplastic polymer, about 0.5 percent to about 35 percent by weight of a polyester resin or vinyl ester resin, and about 20 percent to about 80 percent by weight of an alkyl acrylate or methacrylate monomer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.