Substrate assembly apparatus and substrate assembly method
US7819159B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 2006 |
| Grant date | Oct 26, 2010 |
| Priority date | — |
| Expiry date | Aug 26, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F2202/28
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A bonding apparatus, suitable for accurately bonding large substrates for a liquid crystal display, includes Z-axis drive mechanisms, and upper and lower chambers. The Z-axis drive mechanisms for moving an upper frame vertically are disposed at four corners of a mount. The upper chamber is supported by the upper frame and has an upper table inside. The lower chamber has a lower table inside and is supported on the mount. The upper and lower chambers are united through a seal ring to define a vacuum chamber. Moving the upper frame moves the upper chamber vertically to open or close the vacuum chamber. The lower table is supported via a free joint stage between the plurality of support legs and the table, and is moved horizontally by a side thrust mechanism disposed outside of the vacuum chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.