Solid state lighting component
US7821023B2 · kind B2 · utility
200Cited by
56References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 2008 |
| Grant date | Oct 26, 2010 |
| Priority date | — |
| Expiry date | May 30, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8583
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.