Process for making contact with and housing integrated circuits
US7821106B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2008 |
| Grant date | Oct 26, 2010 |
| Priority date | — |
| Expiry date | Mar 4, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/811
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for producing electrical contact connections for a component integrated in a substrate material is provided, the substrate material having a first surface region, and at least one terminal contact being arranged at least partially in the first surface region for each component, which is distinguished in particular by application of a covering to the first surface region and production of at least one contact passage which, in the substrate material, runs transversely with respect to the first surface region, in which process, in order to form at least one contact location in a second surface region which is to be provided, at least one electrical contact connection from the contact location to at least one of the terminal contacts is produced via the respective contact passages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.