Heat sink with preattached thermal interface material and method of making same
US7821126B2 · kind B2 · utility
10Cited by
52References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2008 |
| Grant date | Oct 26, 2010 |
| Priority date | — |
| Expiry date | Apr 24, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process of making an integrated heat spreader is disclosed. The integrated heat spreader is stamped with a thermal interface material under conditions to form a diffusion bonding zone between the integrated heat spreader and the thermal interface material. The thermal interface material can have one of several cross-sectional profiles to facilitate reflow thereof against a die during a method of assembling a packaged microelectronic device. The thermal interface material can also have one of several footprints to further facilitate reflow thereof against the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.