Method for using an in package power supply to supply power to an integrated circuit and to a component
US7823279B2 · kind B2 · utility
0Cited by
43References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2002 |
| Grant date | Nov 2, 2010 |
| Priority date | — |
| Expiry date | Apr 1, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A packaged device may be provided with an in package power supply. The in package power supply may be selectively coupled to another component when the packaged device is not active.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.