Coating for reducing contamination of substrates during processing
US7824498B2 · kind B2 · utility
21Cited by
44References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2004 |
| Grant date | Nov 2, 2010 |
| Priority date | — |
| Expiry date | Apr 13, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate support has a support structure and a coating on the support structure having a carbon-hydrogen network. The coating has a contact surface having a coefficient of friction of less than about 0.3 and a hardness of at least about 8 GPa. The contact surface of the coating is capable of reducing abrasion and contamination of a substrate that contacts the contact surface. In one version, the support structure has a dielectric covering an electrode. A plurality of mesas on the dielectric have a coating with the contact surface thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.