Semiconductor device and method of manufacturing semiconductor device
US7825423B2 · kind B2 · utility
11Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2007 |
| Grant date | Nov 2, 2010 |
| Priority date | — |
| Expiry date | Feb 1, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/856
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a semiconductor device 100, a light emitting device 102 is mounted on a substrate 101. A light reflection preventing film 130 for preventing a reflection of a light is formed on an upper surface of the light emitting device 102. Moreover, a plate-shaped cover 103 formed of a glass having a light transparency is disposed above the light emitting device 102, and a light reflection preventing film 140 for preventing a reflection of a light is also formed on an upper surface of the cover 103.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.