Semiconductor module including semiconductor chips in a plastic housing in separate regions

US7825506B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Erich Syri · Wenzenbach, DE
• Gerold Gruendler · Regensburg, DE
• Juergen Hoegerl · Regensburg, DE
• Thomas Killer · Hohenschambach, DE
• Volker Strutz · Tegernheim, DE

Key dates

• Filing date: Mar 27, 2006
• Grant date: Nov 2, 2010
• Expiry date: Mar 31, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/10674
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor module and a method for producing the same is disclosed. In one embodiment, the semiconductor module has adjacent regions on a common wiring substrate in a common plastic housing composition. The regions are thermally decoupled by a thermal barrier. Semiconductor chips whose evolution of heat loss differs are arranged in these thermally separate regions, the thermal barrier ensuring that the function of the more thermally sensitive semiconductor chip is not impaired by the heat-loss-generating semiconductor chip.