Method for air gap formation using UV-decomposable materials
US7829268B2 · kind B2 · utility
1Cited by
5References
21Claims
0Family size
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Key dates
| Filing date | Oct 17, 2007 |
| Grant date | Nov 9, 2010 |
| Priority date | — |
| Expiry date | May 9, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of selectively removing a sacrificial material on a substrate is described. The method comprises forming a sacrificial layer on a substrate. Thereafter, the sacrificial layer is selectively decomposed at a temperature less than the temperature required to thermally decompose the sacrificial layer by selectively exposing the sacrificial layer to UV radiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.