Conductive ball mounting method and apparatus having a movable solder ball container
US7829451B2 · kind B2 · utility
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1References
7Claims
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Assignee
Inventors
Key dates
| Filing date | Jul 17, 2008 |
| Grant date | Nov 9, 2010 |
| Priority date | — |
| Expiry date | Sep 30, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/17
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of mounting conductive balls on pads on a substrate includes: (a) placing the substrate having the pads coated with an adhesive over a container for containing the conductive balls therein and whose top surface is open such that the pads faces the top surface of the container; and (b) throwing up the conductive balls in the container by moving the container up and down at a given stroke, thereby allowing the conductive balls to adhere to the adhesive coated on the pads. Step (b) is repeatedly performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.