Kiyoaki Iida
18Patents
4h-index
23Co-inventors
56Inventor score
Filing activity: Dec 12, 2006 → Aug 14, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7989707B2 | Chip embedded substrate and method of producing the same | Emerging Cross-Sectional Technologies | 50 | Active |
| US8793868B2 | Chip embedded substrate and method of producing the same | Emerging Cross-Sectional Technologies | 12 | Active |
| US8720519B2 | Electronic packaging apparatus and electronic packaging method | Emerging Cross-Sectional Technologies | 5 | Active |
| US8671561B2 | Substrate manufacturing method | Emerging Cross-Sectional Technologies | 4 | Active |
| US7703662B2 | Conductive ball mounting apparatus and conductive ball mounting method | Electricity | 3 | Active |
| US7597233B2 | Apparatus and method of mounting conductive ball | Electricity | 3 | Active |
| US7854366B2 | Method of mounting conductive ball and conductive ball mounting apparatus | Electricity | 2 | Active |
| US7854367B2 | Apparatus and method for arranging magnetic solder balls | Electricity | 2 | Active |
| US7784671B2 | Apparatus and method for arranging magnetic solder balls | Electricity | 2 | Active |
| US8299628B2 | Conductive ball mounting apparatus having a movable conductive ball container | Emerging Cross-Sectional Technologies | 0 | Active |
| US10134680B2 | Electronic part embedded substrate and method of producing an electronic part embedded substrate | Emerging Cross-Sectional Technologies | 0 | Active |
| US9768122B2 | Electronic part embedded substrate and method of producing an electronic part embedded substrate | Emerging Cross-Sectional Technologies | 0 | Active |
| US7866533B2 | Conductive ball removing method, conductive ball mounting method, conductive ball removing apparatus, and conductive ball mounting apparatus | Electricity | 0 | Active |
| US7900807B2 | Conductive ball mounting apparatus and conductive ball mounting method | Electricity | 0 | Active |
| US7829451B2 | Conductive ball mounting method and apparatus having a movable solder ball container | Emerging Cross-Sectional Technologies | 0 | Active |
| US9451702B2 | Chip embedded substrate and method of producing the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US8141770B2 | Conductive ball mounting method and surplus ball removing apparatus | Electricity | 0 | Active |
| US7866534B2 | Conductor ball mounting apparatus, conductor ball mounting method, mask used for mounting conductor ball, and mask manufacturing method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.