Patent · US Expired

Device for removing solder material from a soldered joint

US7829817B2 · kind B2 · utility

6Cited by

6References

5Claims

0Family size

Assignee

Pac Tech—Packaging Technologies Gmbh · DE

Inventors

Elke Zakel · Falkensee, DE
Paul Kasulke · Berlin, DE
Oliver Uebel · Berlin, DE
Lars Titerle · Berlin, DE

Key dates

Filing date	Oct 2, 2001
Grant date	Nov 9, 2010
Priority date	—
Expiry date	Oct 2, 2021

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K26/142
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

In a basic variant of a soldering device whereby a laser device is used for melting solder material (3), a protective device is provided which protects the laser lens system (22) from suctioned liquid solder material. Protection of the laser lens system can be achieved by a transverse flow from an inlet channel (23) into an outlet channel (24) and/or by a diaphragm (39) arranged in front of the laser lens system.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.