Patent · US Active

Stacking quad pre-molded component packages, systems using the same, and methods of making the same

US7829988B2 · kind B2 · utility

1Cited by

27References

22Claims

0Family size

Assignee

FAIRCHILD SEMICONDUCTOR CORPORATION · US

Inventors

Yong Liu · Yichun City, CN
Howard Allen · Limington, US
Qiuxiao Qian · Suzhou, CN

Key dates

Filing date	Sep 22, 2008
Grant date	Nov 9, 2010
Priority date	—
Expiry date	Sep 22, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19105
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Pre-molded component packages that may be as thin as a leadframe for a semiconductor die, systems using the same, and methods of making the same are disclosed. The leads of an exemplary package are exposed at both surfaces at the leadframe. The packages may be stacked upon one another and electrically coupled at the exposed portions of their leads.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.