Optical die structures and associated package substrates

US7831115B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Omar J. Bchir · Phoenix, US
• Islam A. Salama · Scottsdale, US
• Charan Gurumurthy · Gilbert, US
• Houssam Jomaa · San Diego, US
• Ravi Kiran Nalla · San Jose, US

Key dates

• Filing date: Mar 20, 2008
• Grant date: Nov 9, 2010
• Expiry date: Jan 30, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10F77/50
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

Optical die structures and associated package substrates are generally described. In one example, an electronic device includes a package substrate having a package substrate core, a dielectric layer coupled with the package substrate core, and one or more input/output (I/O) optical fibers coupled with the package substrate core or coupled with the build-up dielectric layer, or combinations thereof, the one or more I/O optical fibers to guide I/O optical signals to and from the package substrate wherein the one or more I/O optical fibers allow both input and output optical signals to travel through the one or more I/O optical fibers.