Patent · US Active

Micromechanical component and corresponding method for its manufacture

US7834409B2 · kind B2 · utility

9Cited by

4References

10Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Frank Reichenbach · Wannweil, DE
Franz Laermer · Stuttgart, DE
Silvia Kronmueller · Schwaikheim, DE
Christoph Schelling · Stuttgart, DE
Tino Fuchs · Rötteln, DE
Christina Leinenbach · Ensdorf, DE

Key dates

Filing date	Jan 25, 2006
Grant date	Nov 16, 2010
Priority date	—
Expiry date	Jan 25, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH04R31/00
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A micromechanical component having a conductive substrate, an elastically deflectable diaphragm including at least one conductive layer, which is provided over a front side of the substrate, the conductive layer being electrically insulated from the substrate, a hollow space, which is provided between the substrate and the diaphragm and is filled with a medium, and a plurality of perforation openings, which run under the diaphragm through the substrate, the perforation openings providing access to the hollow space from a back surface of the substrate, so that a volume of the medium located in the hollow space may change when the diaphragm is deflected. Also described is a corresponding manufacturing method.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.