Heatplates for heatsink attachment for semiconductor chips
US7834444B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2009 |
| Grant date | Nov 16, 2010 |
| Priority date | — |
| Expiry date | May 11, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16251
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for heatsink attachment and a method for forming the apparatus. The apparatus includes a substrate, a semiconductor chip on top of and physically attached to the substrate, and a lid on top of the substrate. The lid includes a first thermally conductive material. The apparatus further includes a heatsink on top of the lid. The heatsink includes a second thermally conductive material. The semiconductor chip and the substrate share a common interface surface that defines a reference direction perpendicular to the common interface surface and pointing from the substrate towards the semiconductor chip. The lid is disposed between the substrate and the heatsink. The lid includes a first protruding member. The first protruding member of the lid is farther away from the substrate than a portion of the heatsink in the reference direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.