John J. Maloney
24Patents
7h-index
38Co-inventors
69Inventor score
Filing activity: Sep 6, 1991 → May 22, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7405106B2 | Quad flat no-lead chip carrier with stand-off | Emerging Cross-Sectional Technologies | 24 | Active |
| US6346493B1 | Decorative glass enamels | Chemistry; Metallurgy | 19 | Expired |
| US5228910A | Mixed metal oxide crystalline powders and method for the synthesis thereof | Chemistry; Metallurgy | 17 | Expired |
| US7498673B2 | Heatplates for heatsink attachment for semiconductor chips | Electricity | 13 | Active |
| US5725919A | Lead-free glass enamels for decorating glass beverage containers and methods for using the same | Emerging Cross-Sectional Technologies | 9 | Expired |
| US7716992B2 | Sensor, method, and design structure for a low-k delamination sensor | Electricity | 8 | Active |
| US9871176B2 | Glass compositions and glass frit composites for use in optical applications | Electricity | 7 | Active |
| US9205505B2 | Hermetically sealed electronic device using solder bonding | Emerging Cross-Sectional Technologies | 7 | Active |
| US6894382B1 | Optimized electronic package | Electricity | 6 | Expired |
| US7834444B2 | Heatplates for heatsink attachment for semiconductor chips | Electricity | 6 | Active |
| US9272497B2 | Hermetically sealed electronic device using coated glass flakes | Emerging Cross-Sectional Technologies | 3 | Active |
| US9545682B2 | Hermetically sealed electronic device using solder bonding | Emerging Cross-Sectional Technologies | 2 | Active |
| US10562809B2 | Low K dielectric compositions for high frequency applications | Electricity | 1 | Active |
| US9892853B2 | Mid-K LTCC compositions and devices | Chemistry; Metallurgy | 1 | Active |
| US11174170B2 | Modified black spinel pigments for glass and ceramic enamel applications | Chemistry; Metallurgy | 1 | Active |
| US9540274B2 | Low-melting lead-free bismuth sealing glasses | Emerging Cross-Sectional Technologies | 1 | Active |
| US9499428B2 | Formation of glass-based seals using focused infrared radiation | Chemistry; Metallurgy | 1 | Active |
| US11225433B2 | Sintering aid for glasses for machinable phyllosilicate based structures | Chemistry; Metallurgy | 0 | Active |
| US9969648B2 | Induction sealing of inorganic substrates | Chemistry; Metallurgy | 0 | Active |
| US9156735B2 | Hermetic sealing of glass plates | Emerging Cross-Sectional Technologies | 0 | Active |
| US8134225B2 | Quad flat no-lead chip carrier with standoff | Emerging Cross-Sectional Technologies | 0 | Active |
| US10577279B2 | Grain boundary healing glasses and their use in transparent enamels, transparent colored enamels and opaque enamels | Chemistry; Metallurgy | 0 | Active |
| US12195391B2 | Colored glass frits and related methods for laser marking applications | Chemistry; Metallurgy | 0 | Active |
| US10370290B2 | Passivation glasses for semiconductor devices | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.