Semiconductor apparatus
US7834461B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2007 |
| Grant date | Nov 16, 2010 |
| Priority date | — |
| Expiry date | Jan 21, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor apparatus includes a semiconductor device formed to a first surface of a semiconductor substrate, a blocking film provided in a first via-hole, the first via-hole formed with a concave shape to the first surface of the semiconductor substrate, a first via line connected to an electrode of the semiconductor device in contact with the blocking film, a second via line formed inside a second via-hole, electrically connected with the first via line with the blocking film interposed therebetween and being apart of a wiring formed to a second surface, the second via-hole formed with a concave shape to the second surface opposing the first surface of the semiconductor substrate so as to reach the blocking film. The blocking film includes at least one kind of group 8 element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.