Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US7836597B2 · kind B2 · utility
70Cited by
337References
16Claims
0Family size
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Key dates
| Filing date | Jan 6, 2006 |
| Grant date | Nov 23, 2010 |
| Priority date | — |
| Expiry date | Nov 30, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49369
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.