Patent · US Active

Electrical device with covering

US7836764B2 · kind B2 · utility

3Cited by

7References

29Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Horst Theuss · Wenzenbach, DE
Albert Auburger · Regenstauf, DE
Terje Skog · Nykirke, NO
Jean Schmitt · Zeitlarn, DE

Key dates

Filing date	Apr 2, 2007
Grant date	Nov 23, 2010
Priority date	—
Expiry date	Dec 8, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49117
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

The invention relates to a device comprising a sensor chip and a structure housing the sensor chip. The structure is covered by a mold compound and is fabricated from a ceramic or a glass material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.