Method for dicing wafer and process for manufacturing liquid-discharging head using the dicing method
US7837820B2 · kind B2 · utility
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6References
8Claims
0Family size
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Key dates
| Filing date | May 20, 2009 |
| Grant date | Nov 23, 2010 |
| Priority date | — |
| Expiry date | May 20, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1158
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method for dicing a wafer having a first face in which opening are arranged along dicing streets. The method includes a step of affixing a dicing tape to the first face such that the dicing tape lies over the openings and adhesive regions of the dicing tape are exposed in the openings and a step of treating the dicing tape to reduce the adhesive strength of the adhesive regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.