Patent · US Active

Method and apparatus for multi-stage sputter deposition of uniform thickness layers

US7837836B2 · kind B2 · utility

0Cited by
19References
23Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 12, 2004
Grant dateNov 23, 2010
Priority date—
Expiry dateFeb 20, 2028

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC23C14/568
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A method of forming a uniform thickness layer of a selected material on a surface of a substrate comprises steps of:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.