Apparatuses for electrochemical deposition, conductive layer, and fabrication methods thereof
US7837841B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2007 |
| Grant date | Nov 23, 2010 |
| Priority date | — |
| Expiry date | Jul 10, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/16
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electrochemical plating (ECP) apparatuses with auxiliary cathodes to create uniform electric flux density. An ECP apparatus for electrochemical deposition includes an electrochemical cell with an electrolyte bath for electrochemically depositing a metal on a substrate. A main cathode and an anode are disposed in the electrolyte bath to provide a main electrical field. A substrate holder assembly holds a semiconductor wafer connecting the cathode. An auxiliary cathode is disposed outside the electrochemical cell to provide an auxiliary electrical field such that a flux line density at the center region of the substrate holder assembly substantially equals that at the circumference of the substrate holder assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.