Wiring board, method for manufacturing same, and semiconductor package
US7838779B2 · kind B2 · utility
8Cited by
10References
11Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 15, 2006 |
| Grant date | Nov 23, 2010 |
| Priority date | — |
| Expiry date | Jun 15, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0796
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wiring board in which lower-layer wiring composed of a wiring body and an etching barrier layer is formed in a concave portion formed on one face of a board-insulating film, upper-layer wiring is formed on the other face of the board-insulating film, and the upper-layer wiring and the wiring body of the lower-layer wiring are connected to each other through a via hole formed in the board-insulating film. The via hole is barrel-shaped, bell-shaped, or bellows-shaped.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.