Integrated circuits; methods for manufacturing an integrated circuit and memory module

US7838861B2 · kind B2 · utility

Assignees

• Qimonda AG · DE
• Altis Semiconductor, SNC · FR

Inventor

• Ulrich Klostermann · Fontainebleau, FR

Key dates

• Filing date: Sep 17, 2007
• Grant date: Nov 23, 2010
• Expiry date: Feb 9, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10N70/884

Abstract

Embodiments of the present invention relate generally to integrated circuits, to methods for manufacturing an integrated circuit and to a memory module. In an embodiment of the invention, an integrated circuit is provided having a programmable arrangement. The programmable arrangement includes a substrate having a main processing surface, at least two first electrodes, wherein each of the two first electrodes has a side surface being arranged at a respective angle with regard to the main processing surface, the side surfaces facing one another. The programmable arrangement may further include at least one second electrode and ion conducting material between each of the at least two first electrodes and the at least one second electrode, wherein the at least one second electrode is arranged partially between the side surfaces of the two first electrodes facing one another.