Flip-chip package with fan-out WLCSP
US7838975B2 · kind B2 · utility
24Cited by
8References
52Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 12, 2009 |
| Grant date | Nov 23, 2010 |
| Priority date | — |
| Expiry date | Feb 12, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip-chip package includes a package carrier; a semiconductor die having a die face and a die edge, the semiconductor die being assembled face-down to a chip side of the package carrier, and contact pads are situated on the die face; a rewiring laminate structure between the semiconductor die and the package carrier, the rewiring laminate structure including a re-routed metal layer, and at least a portion of the re-routed metal layer projects beyond the die edge; and bumps arranged on the rewiring laminate structure for electrically connecting the semiconductor die with the package carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.