Light emitting device and method of manufacturing the same
US7839087B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 2008 |
| Grant date | Nov 23, 2010 |
| Priority date | — |
| Expiry date | Apr 10, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0361
Abstract
A method of manufacturing a light emitting device. The method includes: mounting a light emitting chip on a substrate; forming a transparent resin portion and a phosphor layer by using a liquid droplet discharging apparatus, the transparent resin portion being formed in a shape of a dome and covering the light emitting chip to fill an exterior thereof on the substrate, a phosphor layer containing phosphor and being formed on an exterior of the transparent resin portion close to at least a top side thereof; and forming a reflecting layer at a position exterior of the transparent resin portion and the phosphor layer close to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.