Programmable through silicon via
US7839163B2 · kind B2 · utility
11Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2009 |
| Grant date | Nov 23, 2010 |
| Priority date | — |
| Expiry date | Jan 22, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Through silicon vias (TSVs) in silicon chips are both programmable and non-programmable. The programmable TSVs may employ metal/insulator/metal structures to switch from an open to shorted condition with programming carried out by complementary circuitry on two adjacent chips in a multi-story chip stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.