Inventor · Hopewell Junction, NY, US

Ping-Chuan Wang

205Patents
15h-index
195Co-inventors
89Inventor score

Filing activity: Sep 30, 1991 → Sep 27, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US6383920B1 Process of enclosing via for improved reliability in dual damascene interconnects Electricity 102 Expired
US9435852B1 Integrated circuit (IC) test structure with monitor chain and test wires Electricity 60 Active
US7139749B2 Method, system, and program for performance tuning a database query Emerging Cross-Sectional Technologies 54 Expired
US7863960B2 Three-dimensional chip-stack synchronization Electricity 30 Active
US8304863B2 Electromigration immune through-substrate vias Electricity 29 Active
US8525549B1 Physical unclonable function cell and array Electricity 28 Active
US7893529B2 Thermoelectric 3D cooling Emerging Cross-Sectional Technologies 23 Active
US7560375B2 Gas dielectric structure forming methods Electricity 21 Expired
US7745282B2 Interconnect structure with bi-layer metal cap Electricity 20 Active
US7569475B2 Interconnect structure having enhanced electromigration reliability and a method of fabricating same Electricity 19 Active
US8237278B2 Configurable interposer Emerging Cross-Sectional Technologies 19 Active
US8299567B2 Structure of metal e-fuse Electricity 17 Active
US8232646B2 Interconnect structure for integrated circuits having enhanced electromigration resistance Electricity 17 Active
US5134089A MOS transistor isolation method Electricity 17 Expired
US7723824B2 Methodology for recovery of hot carrier induced degradation in bipolar devices Electricity 16 Active
US8211756B2 3D chip-stack with fuse-type through silicon via Electricity 15 Active
US7890442B2 Method and system for autocompletion of multiple fields in electronic forms Physics 14 Active
US8159040B2 Metal gate integration structure and method including metal fuse, anti-fuse and/or resistor Electricity 13 Active
US6876282B2 Micro-electro-mechanical RF switch Electricity 12 Expired
US7856332B2 Real time system for monitoring the commonality, sensitivity, and repeatability of test probes Physics 12 Active
US7790599B2 Metal cap for interconnect structures Electricity 12 Active
US8633707B2 Stacked via structure for metal fuse applications Electricity 12 Active
US9059170B2 Electronic fuse having a damaged region Electricity 11 Active
US7839163B2 Programmable through silicon via Electricity 11 Active
US7671444B2 Empty vias for electromigration during electronic-fuse re-programming Electricity 11 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.