Circuit board structure having embedded semiconductor element and fabrication method thereof
US7839649B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 5, 2007 |
| Grant date | Nov 23, 2010 |
| Priority date | — |
| Expiry date | Aug 7, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4602
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit board structure with an embedded semiconductor element and a fabrication method thereof are disclosed according to the present invention. The circuit board structure comprises: a carrier board having a first surface, a second surface, and at least one through hole penetrating the carrier board from the first surface to the second surface; a first semiconductor element received in the through hole and having an active surface and an inactive surface, the active surface having a plurality of electrode pads; at least one second semiconductor element mounted on the carrier board; a first encapsulation layer formed on the first surface of the carrier board to block one end of the through hole; and a second encapsulation layer formed on the second surface of the carrier board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.