Method of optimizing land grid array geometry
US7841078B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2008 |
| Grant date | Nov 30, 2010 |
| Priority date | — |
| Expiry date | Oct 11, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49218
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method, system, and computer program storage product for optimizing land grid array site geometry on an electronic assembly mounting. A first member including at least one convex region is aligned with a first portion of an electronic assembly mounting. A second member is aligned with a second portion of the electronic assembly mounting. The second portion includes at least one concave region corresponding to the convex region of the first portion. The second member includes a dome-shaped region having a predefined geometry. Heat is applied to at least one of the electronic assembly mounting, the first member, and the second member. Pressure is applied to at least one of the first member and the second member to reshape the convex region into a substantially flat surface. Applying pressure also reshapes the concave region into a geometry corresponding to the predefined geometry of the dome-shaped region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.