Method and apparatus for personalization of semiconductor
US7842525B2 · kind B2 · utility
13Cited by
9References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 31, 2007 |
| Grant date | Nov 30, 2010 |
| Priority date | — |
| Expiry date | Jun 23, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A system for making small modifications to the pattern in standard processed semiconductor devices. The modifications are made to create a small variable part of the pattern against a large constant part of the same pattern. In a preferred embodiment the exposure of the variable and constant parts are done with the same wavelength in the same combined stepper and code-writer. The invention devices a way of writing variable parts of the chip that is automatic, inexpensive and risk-free. A system for automatic design and production of die-unique patterns is also shown.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.