Patent · US Active

Method and device for the thermal treatment of substrates

US7842905B2 · kind B2 · utility

2Cited by

10References

30Claims

0Family size

Assignee

Steag Hamatech AG · US

Inventors

Werner Saule · Bretten, DE
Lothar Berger · Bonn, DE
Christian Krauss
Robert Weihing · Heuchelheim, DE

Key dates

Filing date	Nov 12, 2005
Grant date	Nov 30, 2010
Priority date	—
Expiry date	Nov 24, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/67103
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

This invention relates to a method and a device for the thermal treatment of substrates in which the substrates are held in contact with or a small distance away from a heating plate, which is heated by a plurality of separately controllable heating elements on the side of the heating plate facing away from the substrate, the heating plate being surrounded, at least in its plane, by a frame spaced apart therefrom, and gas being conveyed, in a controlled manner, through a gap between the frame and at least one edge of the heating plate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.